Grinding & Honing Tools

BSL and Electroplated Wheels – Brake Pad Grinding

Slotted BSL and electroplated grinding wheels for economical grinding of friction surfaces, chamfers, and grooves on brake pads.

BSL- und Galvanikscheiben – Bremsbelagschleifen

When grinding brake pads, dimensional accuracy, surface quality, and process stability are the central concerns. Different friction lining compounds – from organic to metal-containing compounds – require a tool with stable cutting ability and controlled chip formation.

Slotted BSL or electroplated grinding wheels are used for series and high-volume production. They enable economical grinding of friction surfaces, chamfers, grooves, and edges while maintaining high reproducibility.

Product program

BSL grinding wheels (Brazed Single Layer)

  • Bond system: metallurgically brazed single-layer coating (vacuum brazing process)
  • Abrasive: diamond (organic/ceramic linings) or CBN (highly metallic compounds)
  • Grain protrusion: approx. 60–80 % of grain size for large chip spaces
  • Grit sizes: typically D54 – D181
  • Versions: slotted, segmented, or cylindrical (e.g. for drum brake linings)
  • Application focus: high-performance surface grinding and thickness calibration with maximum removal rate, thermally stable process, and high tool life in high-volume production

Electroplated grinding wheels (nickel-bonded, EP)

  • Bond system: electrochemically deposited nickel layer (single layer)
  • Abrasive: diamond or CBN, matched to material
  • Grain protrusion: approx. 30–50 % of grain size
  • Grit sizes: typically D64 – D181
  • Versions: profiled for chamfer, groove, and contour machining; slotted for improved chip removal
  • Special feature: recoating of the base body is possible
  • Application focus: geometrically defined chamfer and groove machining with high profile accuracy and reproducible edge quality

Process and benefits

  • High grain protrusion (BSL) – cool grinding and stable surface
  • High profile accuracy (electroplated) – reproducible chamfer and groove geometry
  • Stable grain retention – less downtime and consistent quality

Application example

EP | EHWA BSL bond – grinding of brake pads (NAO / low-steel) in series production.

Process parameters, brake pad grinding
Workpiece dimensionPassenger car disc brake pad, length approx. 150 mm
Grinding wheel diameter400 mm (BSL, slotted)
Peripheral speed60 – 70 m/s
Feed rate0.3 – 0.5 mm/s
Infeed0.8 – 1.2 mm total
SpecificationBSL diamond, grit D91

Grinding wheel tool life increased by up to 25 %. Result: fewer tool changes, consistent material removal, reduced heat generation, lower unit costs through stable cycle time and less scrap.